FR4 is the industry-standard substrate material for printed circuit boards, offering exceptional reliability and performance for electronic applications. This flame-retardant fiberglass composite consists of woven glass fiber cloth impregnated with epoxy resin, creating a robust foundation for circuit construction.
Key Properties:
- Excellent electrical insulation with high dielectric strength and low dissipation factor
- Superior mechanical strength providing dimensional stability and resistance to warping
- Flame retardant characteristics meeting UL94 V-0 flammability standards for safety compliance
- Temperature resistance operating effectively from -40ยฐC to +130ยฐC continuous use
- Moisture resistance with low water absorption for consistent performance
- Chemical resistance to most solvents and cleaning agents used in PCB manufacturing
Technical Specifications:
- Dielectric constant: 4.2-4.8 at 1MHz
- Glass transition temperature (Tg): 130ยฐC-140ยฐC
- Thermal expansion coefficient: 14-17 ppm/ยฐC
- Flexural strength: 415 MPa minimum
- Standard thicknesses: 0.4mm to 3.2mm (custom thicknesses available)
Applications: Ideal for consumer electronics, telecommunications equipment, automotive systems, industrial controls, LED lighting, and general-purpose electronic devices requiring reliable circuit board performance.
Manufacturing Compatibility: Fully compatible with standard PCB fabrication processes including drilling, plating, etching, and soldering. Excellent copper adhesion ensures reliable trace formation and component attachment.
FR4 delivers the perfect balance of electrical performance, mechanical durability, and cost-effectiveness, making it the preferred choice for engineers and manufacturers worldwide.
