Transform Your Vision into Reality with Precision AR-Ready PCBs
Our cutting-edge PCB manufacturing services specialize in creating high-performance printed circuit boards designed specifically for Augmented Reality applications. We understand the unique demands of AR electronics, where miniaturization, signal integrity, and thermal management are critical to delivering immersive user experiences.
Key Features
Ultra-Compact Design Capabilities Engineered for the space-constrained world of AR devices, our PCBs support extremely dense component layouts with trace widths down to 75μm and via sizes as small as 0.1mm. Perfect for lightweight headsets, smart glasses, and portable AR controllers.
Advanced Multi-Layer Technology Our state-of-the-art fabrication supports up to 32-layer HDI (High Density Interconnect) boards with sequential lamination, enabling complex AR systems to integrate processors, sensors, displays, and wireless connectivity in minimal footprint designs.
Signal Integrity Optimization AR applications demand flawless data transmission for real-time rendering and sensor fusion. Our PCBs feature controlled impedance routing, differential pair matching, and advanced ground plane design to minimize EMI and ensure stable high-speed signal paths up to 56 Gbps.
Thermal Management Solutions Integrated thermal vias, copper coin technology, and specialized substrate materials effectively dissipate heat from high-performance AR processors and GPUs, maintaining optimal operating temperatures for sustained performance.
Flexible-Rigid Construction Hybrid flex-rigid PCBs accommodate the complex geometries of AR wearables, providing reliable connections between fixed components and moveable elements like adjustable displays or articulating arms.
Applications
- AR/VR Headsets and Smart Glasses
- Mixed Reality Controllers and Input Devices
- Spatial Computing Processors
- Computer Vision Camera Modules
- Wireless Communication Modules
- Battery Management Systems
- Sensor Fusion Boards
Quality Standards
All PCBs are manufactured to IPC Class 3 standards with comprehensive testing including automated optical inspection (AOI), in-circuit testing (ICT), and functional verification. Our ISO 9001:2015 certified facility ensures consistent quality and reliability for mission-critical AR applications.
Ready to bring your AR innovation to market? Contact our engineering team for custom PCB solutions tailored to your specific augmented reality requirements.
