Product Specifications
The XC5VLX85-1FFG676I features a robust architecture built on advanced 65nm process technology, providing optimal balance between performance, power efficiency, and cost-effectiveness. This FPGA incorporates 81,920 logic cells with 12,960 configurable logic blocks (CLBs), offering substantial processing capability for complex digital designs.
Key technical specifications include 648 input/output pins in the FFG676 package format, supporting various I/O standards for versatile system integration. The device operates reliably across industrial temperature ranges from -40ยฐC to +100ยฐC, making the XC5VLX85-1FFG676I suitable for harsh environmental conditions.
Memory resources include 2,160 Kb of block RAM and 16 dedicated multipliers, enabling efficient data storage and arithmetic operations. The integrated PowerPC 440 processor core provides embedded processing capabilities, while multiple clock management tiles ensure precise timing control across the entire system.
Price
Pricing for the XC5VLX85-1FFG676I varies based on quantity, packaging options, and distributor channels. Contact authorized Xilinx distributors for current pricing information, volume discounts, and lead times. Educational institutions and development partners may qualify for special pricing programs.
Factors affecting cost include order quantities, delivery requirements, and additional services such as programming or testing. Long-term supply agreements are available for high-volume production applications requiring the XC5VLX85-1FFG676I.
Documents & Media
Comprehensive technical documentation supports the XC5VLX85-1FFG676I implementation process. The official datasheet provides detailed electrical characteristics, timing specifications, and pinout information essential for design integration.
Additional resources include application notes covering specific use cases, reference designs demonstrating best practices, and migration guides for transitioning from other FPGA families. Video tutorials and webinars offer step-by-step guidance for maximizing the XC5VLX85-1FFG676I capabilities.
Development tools documentation includes user guides for Xilinx ISE Design Suite, constraint file templates, and debugging methodologies. Package mechanical drawings and thermal modeling data assist with board layout and thermal management planning.
Related Resources
The XC5VLX85-1FFG676I integrates seamlessly with Xilinx’s complete development ecosystem. ISE Design Suite provides the primary development environment, offering synthesis, implementation, and debugging tools optimized for Virtex-5 devices.
Evaluation boards and development kits accelerate prototyping and proof-of-concept development. Third-party IP cores expand functionality while maintaining compatibility with the XC5VLX85-1FFG676I architecture.
Training resources include online courses, certification programs, and technical support forums where engineers share XC5VLX85-1FFG676I implementation experiences and solutions.
Environmental & Export Classifications
The XC5VLX85-1FFG676I complies with international environmental standards including RoHS directive requirements for lead-free manufacturing processes. Environmental stress testing validates operation across specified temperature, humidity, and vibration ranges.
Export classification follows standard semiconductor trade regulations. The device typically falls under standard commercial export categories, though specific applications may require additional compliance verification. Consult current export control documentation for applications involving restricted technologies or destinations.
Conflict minerals reporting ensures responsible sourcing throughout the XC5VLX85-1FFG676I supply chain. Detailed material composition data supports environmental impact assessments and end-of-life recycling programs.
The XC5VLX85-1FFG676I represents proven FPGA technology suitable for applications demanding reliable performance, extensive I/O capabilities, and comprehensive development tool support. Its combination of processing power, connectivity options, and environmental robustness makes it an excellent choice for industrial, communications, and embedded system applications.
