Rigid PCB Capacity

Items	Mass	Prototypes
Layers	1-8 Layers	1-20 Layers
Max. Panel Size	600770mm( 23.62"30.31")	600770mm(23.62"30.31") 5001200mm(19.69"47.24")
Max.Board Thickness	8.5mm	8.5mm
Min. Board Thickness	2L:0.3mm	2L:0.2mm
	4L:0.4mm	4L:0.4mm
	6L:0.8mm	6L:0.6mm
Min Inner Layer Clearance	0.1mm(4mil)	0.1mm(4mil)
Min Line width	0.1mm(4/4 mil)	0.075mm(3/3 mil)
Min Line space	0.1mm(4/4 mil)	0.075mm(3/3 mil)
Min.Hole Size	0.2mm(8mil)	0.15mm(6mil)
Min plated hole thickness	20um(0.8mil)	20um(0.8mil)
Min Blind/Buried hole size	0.2mm(8mil)	0.2mm(1-8layers)(8mil)
PTH Dia. Tolerance	±0.076mm(±3mil)	±0.076mm(±3mil)
Non PTH Dia. Tolerance	±0.05mm(±2mil)	±0.05mm(±2mil)
Hole Position Deviation	±0.05mm(±2mil)	±0.05mm(±2mil)
Heavy Coppe	4OZ/140μm	6OZ/175μm
Min S/M Pitch	0.1mm (4mil)	0.1mm (4mil)
Soldermask colour	Green,black,Blue,White,Yellow,Red	Green,black,Blue,White,Yellow,Red
Silkscreen colour	White,Yellow,Red,Black	White,Yellow,Red,Black
Outline	Routing,V-Groove, Beveling punch	Routing,V-Groove, Beveling punch
Outline Tolerance	±0.15mm ±6mil	±0.15mm (±6mil)
Peelable mask	Top,bottom,double sided	Top,bottom,double sided
Controlled Impedance	+/- 10%	+/- 7%
Insulation Resistance	1×1012Ω(Normal)	1×1012Ω(Normal)
Through Hole Resistance	<300Ω(Normal)	<300Ω(Normal)
Thermal Shock	3×10sec@288℃	3×10sec@288℃
Warp and Twist	≤0.7%	≤0.7%
Electric Strength	>1.3KV/mm	>1.4KV/mm
Peel Strength	1.4N/mm	1.4N/mm
Solder Mask Abrasion	>6H	>6H
Flammability	94V-0	94V-0
Test Voltage	50-330V	50-330V

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