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With the ever-changing industry demands, PCB applications also followed with change, especially electronic products toward the direction of the evolution of compact size, the electronic circuit board carrying the bulk of the volume of applications, more and more small end, replaced by a higher-precision smart mobile devices , PCB demand also diversified towards more advanced direction ... According to ITIS market research information that Taiwan PCB industry in 2012, 2013, showing growth slow slightly in 2013, one hundred million yuan annual output value of NT $ 4,057 level, the annual slowdown has become critical warning. Looking at Taiwan's PCB products can be found in the proportion of use, market information display computer and communication products account for more than 50% PCB applications, due to the major international brand computers, communications products market accounted for the poor performance of the joint impact of Taiwan's PCB industry, PCB industry must address the future market and related advanced applications early layout.  2014 wearable applications will continue to surge, Apple published picture shows the Apple Watch products. Apple Smart glasses products are small, relatively limited circuit carrier board space can be used, use the flexible printed circuit board connected to the sensor and other key components. Google
    Global PC / NB inject replacement demand slowing demand business  Another View of Taiwan Printed Circuit Association (TPCA) questionnaire results every six months for industry executives, professionals, and to publish the results of the survey in the first half 2014 content to observe, even if the third quarter of 2013 worldwide PC sales were better than expected, although global PC sales fell to the lowest level since 2008, but it appears in the report IDC Japan, even though overall consumer PC market demand in a downward, business applications market by the end of Microsoft Windows XP systems will support services that affect in April 2014, but Japanese companies to stimulate a wave of commercial PC replacement boom, synchronous boost the overall commercial PC market shipments. End product market performance impact of the year 2013 by the PCB industry performance, tablet computers, smart phones strong demand for mobile devices, even if PC manufacturers are facing shipments continued to decline, but in the second half of 2013 NB factory competing push deformation plate snatch tablet computer products computer market, effectively pushing up the lackluster sales of conventional NB equipment market sales. Wearable devices popular soft board applications demand growth The existing PCB application market is still large computers, communications products, the world's largest computer and communications industry accounted for the poor performance of the city, and it gets a direct impact on the amount of PCB and revenue, while ICT products slowdown, the overall market demand for PCB decline, PCB industry how critical need for sustainable development has become an important breakthrough, it will examine the market development trend of electronic products, communications products will find funding continued towards lightweight and thin-oriented development, in addition to intelligent electronic terminal devices outside progress, continued direction toward extreme miniature wearable application integration. 2013 can be said that the concept of wearable devices brewing and collision of the year, from the wisdom bracelet, watch all kinds of wisdom wisdom glasses even wearable devices springing launched related products from the masses curtain-owned, new and creative industries, or break previous angle-owned communications companies, industry by a motion or horizontal integration concept introduced new products, existing products in the conceptual and practical concept after several years after the collision, 2014 in wearable applications gradually matured, become advance Important thrust ICT products industry growth. Intelligent Terminal highly integrated miniature Looking at market trends in PCB applications in 2014, due to market desktop computers, notebook computers the amount of atrophy, terminal sales with smart phones, tablet computer market performance is more brisk, and the use amount of PCB-like state due to different products continued to decline, towards thin , high-density, multilayer direction of integration, but also because the end product of smart devices continue miniature size, the amount of the flexible circuit board also needs a positive improvement. Plus tablet computers, smart phones using the embedded processor platform, continued toward the direction of highly integrated SoC based, general-purpose processor integrated memory, storage components, communications capabilities and other core applications unit, but also to the needs of the electronic circuit carrier board drastically reduced, After the miniaturization of electronic circuits instead it is thinning for the end product, the amount of demand for sophisticated lightweight flexible circuit boards continues to increase. Wearable device 2014 will be critical of the massive demand for related products The same situation also appears in 2014, the amount of violence began wearable applications boom, smart bracelet products, for example, in the smart bracelet product design, primarily for full-time permanent record dynamic wearer, Through MCU with MEMS sensors capture user activity day record, in the hardware architecture wearable products by MCU (low) with a MEMS sensor integration, while additional low-power Bluetooth wireless communication and battery module, electronic circuit layout is relatively simple, In order to design and wearable accessories or sports application integration, flexible circuit boards soft high but is dressed application of choice, the same situation also appears Google Glass smart glasses product development at Google, as the product is relatively free space configuration small, using integrated circuit packaging process integration electronic circuit, with soft integrated circuit board connectors, touch module or key sensor for mainstream applications wearable common design direction. Unlike the growing amount of shrinkage of the desktop computer, laptop computer PCB amount, the amount of special PCB also is continuing to increase, the relevant application also should not be underestimated, for example in the automotive electronic, energy-saving vehicles / smart car consolidation trend, imported used cars ECU continues to increase the amount of electrical equipment and electronic needs, not only to drive forward the development of automotive electronics market, while also increasing the car with PCB market demand, but also energy-efficient LED lighting applications under the concept, since the terminal LED light bulb, lamp market demand increased boards, also contributed to enhance the application requirements contained in the corresponding PCB circuit boards, automotive electronics, LED lighting applications PCB amount of special needs, also contributed to the PCB market momentum in ICT goods towards miniaturization direction PCB amount Under less condition, a little supplement PC / NB market demand slowing amount of status. Focus on the future, a high value-added product applications But the PCB market in the long term, depends on tablet computers, smart phones or wearable applications limited market demand to boost the amount of kinetic energy, in addition to related products in a highly integrated product configuration and miniature electronic circuits trend, PCB amount of the less and less, although driven by high efficiency soft board amount, but the amount of conventional PCB needs a little help, PCB huge growth market situation should be little chance, but is focused on the future products, innovative applications to create high value-added application opportunities bigger. Not only wearable applications, advanced smart handheld devices drive high-precision multilayer integrated circuits or integrated packaging solutions anticipated, the relevant miniaturized ICT equipment driven soft circuit boards increasingly buoyant demand, while derivatives such as medical electronics, innovative applications market applications although the amount is not large, but the relevant special applications with higher gold content, added value or higher than the average PCB soft circuit board, but also the future direction of the PCB industry can continue to concern. Also observe the status of the mainland market, the brand of smart phones still continue to show high growth to IDC research market research agency noted that in 2013 China smartphone shipments expected to reach 360 million, the estimated 2014 shipments continued at a high amplitude positive growth in the world's major ICT industry is still actively involved in the brand new electronic product development and production, currently wearable devices, automotive electronics, medical electronics and other emerging applications market, has become the target of various PCB manufacturers active layout.

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Posted in PCB Technology By vivian vivian

What is SMT?

Thursday, April 23, 2015 10:18:56 AM Asia/Shanghai

What is SMT?

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Posted in SMT News By anni anni

Samsung partners, Romania: 14 nanometers LPE process yield at double digits

Friday, April 10, 2015 1:30:50 PM Asia/Shanghai

Samsung partners, Romania: 14 nanometers LPE process yield at double digits

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Posted in SMT News By hugo hugo

PCB copy board process

Wednesday, April 8, 2015 12:14:41 PM Asia/Shanghai

PCB copy board process

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Posted in PCB Technology By Tim Tim

Role as the incoming inspection of raw materials required for the production of multi-layer PCB board copper clad laminates, the quality is good or bad will directly affect the production of multi-layer PCB board. By metallurgical microscope 

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Posted in Industry News By Tina -RayPCB

Line mill solder process

Thursday, April 11, 2013 5:08:39 PM Asia/Shanghai

Lines MILL procedures for exposure. To check the exposure box before exposure polyester film and the bezel is clean, if not clean should be timely and anti-static cloth to wipe clean, and then open the the exposure machine's power switch, and then turn on the vacuum button to select the Exposure program, shaking exposure shutter not started before the exposure, exposure machine should be allowed to air exposure five times, the role of the "empty exposure enables the machine to enter the saturated state, the most important is the UV lamp energy into the normal range . If you do not "empty exposure the exposure lamp energy may not have access to the best working condition. Will make the printed circuit board in the exposure problems. After the empty exposure "five times, exposure machine has entered the best working condition before the camera bottom plate position to check the quality of the bottom plate is qualified. Check the bottom plate on the membrane surface if there is pinhole and the exposed portion of the light, the graphics are consistent with the printed circuit board, because it will check photographic Diban avoided because some unnecessary reason the printed circuit board rework or scrap.

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Posted in Industry News By Nicole -RayPCB

First, the traditional process Profile Traditional through-hole electronic assembly process is the component of the pin is inserted into the guide hole of the PCB fixed wave soldering (Wave Soldering) process, flux coating, preheat, solder coating, detection and cleaning steps complete the welding process. Surface Mount Technology About Electronics industry products and trends over time continued its product design into a short, lightweight, relatively prompted a variety of zero volume and weight of the components getting smaller the functional density relative increase, in line with the trend of the times and customer demand this changes under the influence of surface mount components on the PCB of the main components, its main feature is the space savings to replace the traditional dip soldering components (Dual In Line Package; DIP). Surface mount assembly process includes the following main steps: solder paste printing, component placement, reflow soldering. Its steps are summarized as follows: Solder paste printing (Stencil Printing): solder paste for surface mount components and PCB interconnected conduction followed by materials, the first steel plate by etching or laser cutting presses scraper (squeegee) solder paste through the plate opening India to PCB pads, in order to proceed to the next step. Component placement (Component Placement): component placement entire SMT process technology and the key focus of the work, its process using a high-precision automated placement equipment, surface mount components to be accurately placed in via the computer programming has been printed solder paste PCB pads. Since the design of the surface mount components increasingly sophisticated, pin spacing also will be smaller, so the placement of the difficulty of the technical level of the job is also increasing. Reflow soldering (Reflow Soldering): reflow soldering has placed surface-mount PCB components after reflow oven preheated prior to activate the flux, and then enhance the temperature to 183 ° C to melt solder paste the component foot with the PCB pad relative link, then after cooling down, the solder curing complete surface mount components and PCB bonding. Four SMT common name explained SMT: surface mounted technology (surface mount technology): Direct surface mount component placement, soldered to the the surface prescribed position on the printed circuit board assembly technology. SMD: surface mounted devices (surface mount components): shape of a rectangular sheet, cylinder line-shaped or profiled weld ends or pin production in the same plane, and suitable for surface mount electronic components. Reflow soldering (reflow soldering): pre-allocated by re-melting the paste solder paste to the printed circuit board pad, mechanical and electrical connection between the terminal or pin surface mount components and printed circuit board pad. Chip: rectangular chip component (rectangular chip component): both ends of the lead-free welding ends, shape for sheet rectangular surface mount components. SOP: small outline package (small outline package): small molded plastic package, both sides of the wing or J-shaped short pin surface mount components. QFP: quad flat pack (quad flat package): the four sides of the wing short pin, pin spacing: 1.00,0.80,0.65,0.50,0.40,0.30 mm plastic package thin surface mount collective circuit. BGA: Ball grid array (ball grid array): integrated circuit packaging, the input and output point of the solder ball grid array pattern element on the bottom surface. V. Component Package. Material strip (magazine / stick) (shipping tube) - the main component container: material strips of transparent or translucent polyethylene (PVC) material, squeezed into a standard form factor can be applied to meet current industry standards. Article expected size of the industry standard automatic assembly equipment to provide proper component positioning and direction. The packaging and transport of the material strips to the number of combinations of single material strips. Tray (tray) - the main components of the container: Pallets by toner or fiber materials made of these materials to select the maximum temperature rate based on the special tray. The components designed for applications requiring exposure to high temperatures (moisture-sensitive element) of the tray having a typically 150 ° C or higher temperature. Tray cast into rectangular standard shape, well matrix containing uniform white. Pockets boosting the elements, to provide protection during transport and processing components. Interval is used to mount standard industrial automated assembly equipment in the circuit board assembly process to provide accurate component location. Packaging and transportation of the trays in combination in the form of a single tray, then stacked and tied together with a certain rigidity. An empty cover tray on the installed components and heap tray stacked together. Tape & Reel (tape-and-reel) - the main component containers: a typical coil structures are designed to meet the needs of modern industry standard. There are two generally accepted covering standard Tape & Reel packaging structure. Applied to the embossed structure (embossed), EIA-481 and EIA-468 used in radial leaded components (radial leaded). So far, for the active (active) of the most popular structure of the ICs is embossed with (Embossed Tape). Six. Whv the surface mount technology applications Free cleaning process Wastewater discharged after the cleaning products in the production process, bring the water quality, pollution of the earth as well as plants and animals. 2 in addition to the water washing, the organic solvent of the application of hydrogen containing chlorofluorocarbons (CFC & HCFC) for cleaning, and also the air, atmospheric pollution, damage. 3. Cleaning agent residue in the machine board corrosion, seriously affecting the quality of their products. Reduce the cost of the cleaning process operation and machine maintenance. 5 Free cleaning can reduce the damage caused in the process of moving and cleaning of the group board (PCBA). Still some components unbearable cleaning. 6. Flux residues under control, with the appearance of the product requires the use, to avoid visual check clean state. Residual flux has been constantly improving its electrical properties, in order to avoid the finished produce leakage to cause any harm. Disposable process has been through a number of international safety testing, to prove that the chemicals in the flux is stable, non-corrosive. VII. SMT basic craft elements and characteristics SMT basic craft elements: screen printing (or dispensing), Mount (curing), reflow soldering, cleaning, inspection, repair. Screen Printing: its role misprinting paste or plastic patch to the pad on the PCB, to prepare for the components of the welding. Equipment for screen printing machine (screen printers), located in the forefront of SMT production lines. Dispensing: it is a the glue dripping PCB fixed position, its main role is to fixed components to the PCB. Equipment used for the dispenser, most SMT production line at the front or the back of the testing equipment. Mount: its role is the surface mount components accurately mounted to the fixed position of the PCB. Equipment used for the placement machine, located in the back of the screen printing machine in SMT production lines. Cure: its role is to melt the plastic patch, so that the surface mount components and PCB board firmly bonded together. Equipment used for the curing oven is located in the back of the placement machine in SMT production lines. Reflow soldering: solder paste melts and surface mount components and PCB board firmly bonded together. Equipment used for the reflow oven, located in the back of the placement machine in SMT production lines. Cleaning: its role is to remove the assembled PCB board above the welding harmful residue such as flux. Equipment used for the washing machine, the position can not be fixed, can be online or not online. Detection: its role in the quality of welding and assembly quality testing of assembled PCB board. The equipment used a magnifying glass, microscope, online tester (ICT), flying probe tester, automated optical the detection (AOI), X-RAY detection system, functional tester. Position according to the needs of the detection can be configured in the production line is suitable. Rework: its role is to detect failure of the PCB rework. The tools used for soldering iron rework station. Configuring an arbitrary position in the production line. A pcb process entry must learn: some of the basic terminology of the printed circuit board Under a rich area of ​​electronic production lines dissatisfaction with the Japanese side to transfer the right to operate the factory strike

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Posted in PCB Technology By Ted -RayPCB

Intel or production 10 nm process chip in Israel

Thursday, March 14, 2013 2:19:19 PM Asia/Shanghai

Intel or production 10 nm process chip in Israel

 

Intel subsidiary of Israel in 2012 export volume doubled to $4.6 billion, the company is seeking to put Intel's next-generation chip production in Israel.

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Posted in Industry News By Lisa -RayPCB

Circuit board before shipment at the tin test, customers course in the use of time meeting tin solder components. Two phases may occur, or occur at a certain stage of immersion tin or solder blistering, peeling substrate, is to do the tape test ink peel strength, tensile testing soft board that ink can cover film peel strength significantly peel or cover film peel strength is insufficient or uneven, this type of problem customers, especially customers is absolutely unacceptable to do precision SMT placement. Once the solder mask layer welding since photodetachment phenomenon will lead to not be able to accurately mount the original, leading to the loss of customers will face a large number of components and loss of working time, circuit board deductions, fed, and even lost customers and huge losses. So we usually encounter such problems in those aspects go about it? We usually go to analysis is not the solder mask (ink, cover film) material; screen printing, laminating, curing stage is not a problem; is not plating syrup? And so on. . . So we usually ordered engineers to be sure from the section - to find out the reasons, and to improve. We also think it is not the reason of the weather? More humid, plates absorb moisture? (Substrate and barrier hygroscopic) After an arduous struggle, how much can harvest these effects, temporary solution on the surface. However inadvertently such problems occur, then what is the reason? Section that may be a problem obviously has been checked to improve before you. What did not notice?

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Posted in PCB Technology By Nicole -RayPCB

Immersion Gold processing is an important part of the printed circuit board, generally include: scrap washed, DI water washing, drying, and other steps, conditional plot with a horizontal washer washer Immersion Gold board drying. Horizontal plane washer can the drug washed (10% sulfuric acid, hydrogen peroxide, 30 g / L), high-pressure DI water washing (30 ~ 50PSI), DI water washing, drying, drying order to set the process to completely remove the printed circuit boards hole surface syrup and water stains, uniform coating, brightness good immersion gold.

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Posted in PCB Technology By Nicole -RayPCB
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