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Best way to solve the PCBA process problems

Thursday, May 25, 2017 6:24:27 PM Asia/Shanghai

From the current pcb and assembly(SMT) industry universal existence question, proposes three solutions ways 

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Posted in PCB Technology By Jelon Jelon

pcb design problems and improving

Wednesday, April 10, 2013 10:51:23 AM Asia/Shanghai

pcb design problems and improving

Need to be considered an important factor that should pay special attention to before soldering, PCB assembly point of view. Tilting may cause short-circuit problem occurs due to pull out the components of its theoretical position. According to experience, the maximum allowance inclination of the component leads should be kept at a 15 angle with the theoretical position. When the diameter of the hole and pin difference is large tilt - up to reach 20 °. Vertical components of the device, pcb inclination up to 25 or 30 ° but this will lead to the decrease of the packing density. FIG. 3-13TO-18-type transistor in the tilt of the type pin package, FIG TO-I8-type transistor device location away from the printed circuit board 2mm aperture Imm inclination of 20 ° can be achieved, of course pin itself is not any inclination.

 

 

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Posted in Industry News By Nicole -RayPCB

Circuit board before shipment at the tin test, customers course in the use of time meeting tin solder components. Two phases may occur, or occur at a certain stage of immersion tin or solder blistering, peeling substrate, is to do the tape test ink peel strength, tensile testing soft board that ink can cover film peel strength significantly peel or cover film peel strength is insufficient or uneven, this type of problem customers, especially customers is absolutely unacceptable to do precision SMT placement. Once the solder mask layer welding since photodetachment phenomenon will lead to not be able to accurately mount the original, leading to the loss of customers will face a large number of components and loss of working time, circuit board deductions, fed, and even lost customers and huge losses. So we usually encounter such problems in those aspects go about it? We usually go to analysis is not the solder mask (ink, cover film) material; screen printing, laminating, curing stage is not a problem; is not plating syrup? And so on. . . So we usually ordered engineers to be sure from the section - to find out the reasons, and to improve. We also think it is not the reason of the weather? More humid, plates absorb moisture? (Substrate and barrier hygroscopic) After an arduous struggle, how much can harvest these effects, temporary solution on the surface. However inadvertently such problems occur, then what is the reason? Section that may be a problem obviously has been checked to improve before you. What did not notice?

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Posted in PCB Technology By Nicole -RayPCB

Flexible printing labels actual operation

Wednesday, April 18, 2012 11:51:26 AM Asia/Shanghai

Shanghai people printing eight factory since 1992, flexible printing production line imported 1 since, have already owned 5color, seven color, nine color three flexible printing production line. These flexible edition printing machine is mainly used for printing various non-dry tape, coffee, sugar, tea bag packaging and various kinds of alcoholic beverages poster. In 2000, the 2nd national flexible printing product quality appraisal, Shanghai people printing eight factory "multimillionaires beer" and "guizhou maotai" alcoholic logo was named high-quality goods award. I have engaged in the flexible printing labels for many years, also has accumulated some flexible printing experience, however, but in the actual operation process, still can appear such problems need to be solved.

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Posted in Industry News By Anni

With the rapid development of microelectronics technology, large-scale and extensive use of ultra large scale integrated circuit, micro-assembly technology, the manufacture of printed circuit board toward the laminated, multi-functional direction of development, printed circuit patterns leads to thin, porous of the narrow pitch, processing machinery used in the way of drilling technology can not meet the requirements of the rapid development of a new type of porous processing methods that laser drilling technology.

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Posted in Industry News By ray ming
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