Enhance the board adhesive have pressure sensitive type (PSA) and hot and solid type. Its processing need artificial very different also. Use pressure sensitive type is very simple, tore to pressure sensitive type from type of membrane, and flexible printed circuit board position on the overlap after registration, in a very short time, even as long as blade by hand under pressure. When need certain bonding strength in the simple compressor put a few seconds of pressure or through the hot pressing roller.

Use hot and solid adhesive is not so simple. General need 3 ~ 5 MPa (30 to 50 kg/cm.) The pressure and 60 ~ 80 ℃ 1 1 of high temperature, must suppress 30 to 60 min. In order not to make flexible printed circuit board stress influence, and enhance the board by parts of the pressure must be even, if simply to enhance, enhance the pressure plate parts to end by board part stress influence is likely to cause disconnected.

In addition, two sides have from type of film of double-sided sticky conjunctival that can be used to the flexible printed circuit board, and flexible printed circuit board or flexible printed and rigid, PCB sticking together, which is equivalent to half of the PCB rigid used solid piece, its processing curing process and enhance the laminated plates the same process