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How to solve the thermal reliability of the circuit board

Thursday, March 28, 2013 11:54:26 AM Asia/Shanghai

Before modeling analysis line Banban main heating device which, if the MOS transistor and the circuit block, etc., these elements at work, most of the power loss converted to heat. Therefore, modeling mainly need to consider these devices. Also, consider the circuit board on the substrate, as the wire coated foil. They play the role of conductivity in the design is not only, but also play the role of the heat conduction, the thermal conductivity and heat transfer area larger than the line Banban electronic circuit is not an integral part of its structure by the epoxy substrate and as wire coated foil. The epoxy resin substrate having a thickness of 4 mm, a copper foil having a thickness of 0.1 mm. The thermal conductivity of the copper was 400W / (m ° C), while the thermal conductivity of the epoxy resin is only 0.276W / (m ° C). Added copper foil is thin and fine, but then the heat strong guiding role, and therefore can not be ignored in the modeling.

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Posted in Industry News By Nicole -RayPCB

PCB etching process problems should be paid attention to

Friday, April 20, 2012 5:03:36 PM Asia/Shanghai

Etching process, the upper surface etching rate often don"t coincide. Generally speaking, the plates etching rate higher than on board. Because the surface has solution accumulation, weakened the etching reaction. Can adjust fluctuation of the nozzle spray benzopyrazine pressure to solve fluctuation surface etching unequal. Etching printed circuit board a common problem is at the same time make all panels are etching clean is very hard to do, bat edge than board centre parts etching quickly. Using spray nozzle system and swinging is an effective measures. Further improvement through making board center and plate edge is different, the spraying pressure plate frontiers and board back-end intermittent etching of method, we can achieve the whole board face etch uniformity.

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Posted in Industry News By Anni

With the rapid development of microelectronics technology, large-scale and extensive use of ultra large scale integrated circuit, micro-assembly technology, the manufacture of printed circuit board toward the laminated, multi-functional direction of development, printed circuit patterns leads to thin, porous of the narrow pitch, processing machinery used in the way of drilling technology can not meet the requirements of the rapid development of a new type of porous processing methods that laser drilling technology.

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Posted in Industry News By ray ming
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