STMicroelectronics (STMicroelectronics, referred ST) of BiCMOS55 SiGe advanced technologies are used in Europe E3NETWORK project team for the development of next-generation mobile network for high-efficiency, high-capacity data transmission systems.

The rapid growth of mobile data usage, and requires the network system to support greater capacity and higher data transfer rates. And how to speed up the mobile network transformation to advanced network architecture speed mobile backhaul (backhaul) infrastructure is a new challenge, such as heterogeneous network (Heterogeneous Network) and cloud radio access network (RAN, Radio Access Network), wherein the higher frequency band can provide greater bandwidth to support faster data transmission channel.

The construction of these ultra-efficient mobile network equipment manufacturers need to have high-performance and low-power, low-cost LSI electronic components. E3NETWORK project uses ST's highly integrated, low-power BiCMOS55Si manufacturing process, we developed a 55-nm up to 320GHz Ft heterojunction bipolar transistor (HBT, Heterojunction Bipolar Transistors). The manufacturing process of high-frequency analog modules allow integration with high-performance, high-capacity digital modules on a single chip, such as logic circuits, AD / DA converter and a memory.

E3NETWORK project uses BiCMOS55 manufacturer STMicroelectronics, is currently developing an integrated transceiver for outward line (Fronthaul) and backhaul infrastructure to digital multi-modulation, and highly focused pencil beam (Pencil- beam) transmission, data rates of up to 10Gbps. Pencil beam properties can help improve backhaul and outward line frequency reuse rate, while protecting spectrum efficiency (Spectrum efficiency) are not affected during the millimeter-wave (millimeter-wave) interval.

As the EU 7th Framework Programme project, E3NETWORK (Energy efficient transceiver for backhaul of the future networks) brings together many companies, including CEIT (Spain), Fraunhofer (Germany), Alcatel-Lucent (Italy), CEA (France ), INXYS (Spain), OTE (Greece), SiR (Germany), Sivers IMA (Sweden) and STMicroelectronics (Italy).