Circuit board screen printing process is divided into nine sections 56 variables, which requires correct operating procedures, or there will be the following phenomenon.
The screen pull Anyway, never been able to pull uniform or often burst.
Sticky mesh screen frame is not solid, dry slowly, or tear can not afford.
110 mesh screen easy to fall off, or auto burst, burst or fall off during the drying.
Template many mesh or translucent mesh.
Template on the edges of the image have jagged "sawtooth many different types of"
The template image in flushing, part of the red can not afford to, or a red full-out.
Substrates original negatives of arrhythmia, large or small, up, down, left, right, and only one side aligned.
Easy to stick in the printed board, or ambiguous image.
The lines on the template image, such as earthworms bending arrhythmia.
Printing a single plate, printed, the photosensitive plastic part off.
Printed multilayer printed in low, gradually increasing mesh out plastic drain printed, paste board, India is not in place, the most serious is the screen burst.
Solder resist mold off.
Solder mask covering the pressure of overdevelopment.
The solder mask norm bubbles or wrinkling.
The solder resist mold surface atomization, dark, dull.
Text ink come off easily.
Text ambiguous tainted India.
The lines jagged edge of a large tainted India.
In single multilayer printed in the sticky web phenomenon.

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