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The following is my old practice reportAdhesive are generally membrane, two surface with the protection from type membrane. Ripped to one side of the membrane from type adhesive film stuck on the board, then enhance the shape and hole processing, and then the flexible printed circuit board with with hot roller layer pressure laminated together. The material is different, the shape of the dimension precision are different. Epoxy glass cloth laminated paper and phenolic of laminated and rigid plate CNC milling machine can drill or mould processing appearance and holes. Polyester and polyimide film can also use knife mould processing, general summary appearance thin film shape enhance board don"t need processing subtle hole, can use numerical controlled drill and mould processing. If can in short time for disposal or automation, so will reduce the production cost. The reinforced slabs posted in the right position has processing good shape and the flexible printed circuit board, the hole this process, and it is difficult to realize automation of the proportion of big processing cost, because of the work had to rely on artificial, if a flexible printed circuit board to more pieces of different material, and increased cost increase board, on the contrary, if the design simple or use is easy to operation of fixture, will significantly improve the production efficiency, thus reduce the cost. GeChang for improve the process and hard, but still needs some production skills for personnel operation.
Enhance the board adhesive have pressure sensitive type (PSA) and hot and solid type. Its processing need artificial very different also. Use pressure sensitive type is very simple, tore to pressure sensitive type from type of membrane, and flexible printed circuit board position on the overlap after registration, in a very short time, even as long as blade by hand under pressure. When need certain bonding strength in the simple compressor put a few seconds of pressure or through the hot pressing roller.
Use hot and solid adhesive is not so simple. General need 3 ~ 5 MPa (30 to 50 kg/cm.) The pressure and 60 ~ 80 ℃ 1 1 of high temperature, must suppress 30 to 60 min. In order not to make flexible printed circuit board stress influence, and enhance the board by parts of the pressure must be even, if simply to enhance, enhance the pressure plate parts to end by board part stress influence is likely to cause disconnected.
In addition, two sides have from type of film of double-sided sticky conjunctival that can be used to the flexible printed circuit board, and flexible printed circuit board or flexible printed and rigid, PCB sticking together, which is equivalent to half of the PCB rigid used solid piece, its processing curing process and enhance the laminated plates the same process.